CHI TIẾT BÀI BÁO
Force Analysis Model for Elastomer CMP Pad by Diamond Tool
Tác giả: Thi Trần Anh Tuấn(2) Phạm Quốc Phong(1) Chen Chao-Chang A.(3) Gupta Ajay(4) ,
(1) Chủ biên
Abstract: Chemical mechanical polishing/planarization (CMP) process is a primary wafer and thin film planarization process for semiconductor fabrication. In CMP process, a diamond dresser with well-distributed diamond grits is usually applied to regenerate the surface topography of polishing pad for maintaining the wafer material removal rate (MMR). This paper aims to develop a model of reaction force on quasi-orthogonal machining by a pyramid single-diamond tool on a soft elastomer pad. Forces have been analyzed under two dressing conditions which are face dressing direction (FDD) and edge dressing direction (EDD). The reaction force model for the pad has been investigated considering geometry of diamond grit and contact areas between the diamond grit and the pad surface. The reaction force profile obtained by experiment agrees with a simulation of normal reaction forces. Results of this study can be applied to predict diamond wear rate for diamond dressing process. Furthermore it can be extended to design diamond dresser for optimum pad cutting rate (PCR) during dressing process for semiconductor fabricatio
(ISSN:) Số 17
Xuất bản: 6/2019
Trang: 71-78
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