CHI TIẾT BÀI BÁO
Study on pad cutting rate and surface roughness in diamond dressing process
Tác giả: Phạm Quốc Phong(1) ,
(1) Chủ biên
Abstract: Diamond dressing process has an important role in the elimination of scrap materials on the pad surface and regeneration of the pad surface topography before and after Chemical Mechanical Planarization/Polishing (CMP) process for integrated circuit (IC) fabrication. During diamond dressing process, distributions of cutting locus and overlap cutting of diamond grits usually work as a datum surface for pad surface planarization and uniform pad asperities. This paper proposes a novel view to predicting the distribution of pad cutting rate (PCR) and surface roughness based on cutting length and overlap cutting locus. The geometrical model of diamond dressing on the pad has been built and CMP tool parameters are used for the simulation of cutting length and overlap distribution. The distribution of PCR and predict surface roughness is calculated on each pad zone. Simulation results presented a high PCR and roughness is observed in center zones. The verified experiment is in agreement with simulation results where high PCR and roughness is near the center zones, which cause the shape of the pad surface to be concave. The results of this study can be further applied for prediction and optimization of diamond dressing design and improvement of dressing process.
(ISSN:) Số 18
Xuất bản: 15 December 2017
Trang: 1683–1691
Link bài báo:
Đã xem: 293